Electroencephalography (EEG) recordings can be used to help paralyzed patients by replacing functionality of damaged neural connections through the aid of a brain–computer interface. Conventional electrodes used for EEG require long skin preparation due to the impedance of the outermost layers of skin. On the contrary, dry spiked electrodes allow overcoming of impedance problems and can be suitable for long-term measurements. This paper describes microfabrication and packaging of micropatterned dry electrodes built with deep X-ray lithography, electroplating and soft lithography. Preliminary measurements performed with electrodes having different geometries are also described.
Matteucci, M., Carabalona, R., Casella, M., Di Fabrizio, E. M., Gramatica, F., Di Rienzo, M., Snidero, E., Gavioli, L., Sancrotti, M., Micropatterned Dry Electrodes for Brain-Computer Interface, <<MICROELECTRONIC ENGINEERING>>, 2007; (84): 1737-1740. [doi:10.1016/j.mee.2007.01.243] [http://hdl.handle.net/10807/17747]
Micropatterned Dry Electrodes for Brain-Computer Interface
Casella, Michele;Di Fabrizio, Enzo Mario;Snidero, Elena;Gavioli, Luca;Sancrotti, Massimo
2007
Abstract
Electroencephalography (EEG) recordings can be used to help paralyzed patients by replacing functionality of damaged neural connections through the aid of a brain–computer interface. Conventional electrodes used for EEG require long skin preparation due to the impedance of the outermost layers of skin. On the contrary, dry spiked electrodes allow overcoming of impedance problems and can be suitable for long-term measurements. This paper describes microfabrication and packaging of micropatterned dry electrodes built with deep X-ray lithography, electroplating and soft lithography. Preliminary measurements performed with electrodes having different geometries are also described.
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